The company said that, the new BCM21664T platform brings together the processing power of a dual core ARM Cortex A9 with increased graphics and imaging capabilities to enhance the Android 4.2 experience.

The chip is supported by radio frequency (RF), a power management unit (PMU) and an advanced connectivity suite for a complete system solution. The connectivity suite includes Wi-Fi, Bluetooth, GPS and NFC.

The platform will enable the Android smartphones to offer 21.1 Mbps of downstream connectivity and 5.8 Mbps of upstream connectivity. Additionally, the smartphones running on this latest Broadcom platform will incorporate graphic features of 720p HD recording and full 1080p playback supported by over 20GFLOPS of graphics processing capacity.

“By adding an advanced processor with HSPA+ enabled technology to its portfolio of 3G smartphone platforms, Broadcom will deliver an improved Android Jelly Bean experience that allows users to share and connect in meaningful ways,” Jeff Orr, Practice Director, Devices & Applications at ABI Research

The platform is Miracast enabled for HD playback over wireless. Broadcom said that, the platform offers lowest power 3G/2G dual SIM-dual standby to enable global markets.

The company added that the platform is a Complete reference design including schematics, tools, software and carrier specific features.

The BCM21664T is currently sampling with volume production expected in the first half of 2013.